Advanced Packaging Market

Advanced Packaging Market Size By Type (Flip-Chip Ball Grid Array, 5D/3D, Flip Chip CSP, Wafer Level CSP, Fan Out WLP, and Others), and By End-User (Automotive, Healthcare, Consumer Electronics, Industrial, Aerospace & Defense, and Others), Regions, Global Industry Analysis, Share, Growth, Trends, and Forecast 2024 to 2033

Base Year: 2023 Historical Data: 2020-22
  • Report ID: TBI-14204
  • Published Date: Mar, 2024
  • Pages: 238
  • Category: Consumer Goods
  • Format: PDF
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The global advanced packaging market was valued at USD 35.7 billion in 2023, growing at a CAGR of 8.4% from 2024 to 2033 and expected to reach USD 79.9 billion by 2033. The growing need for device miniaturisation, enhanced system performance, and advanced packaging optimisation are some of the key drivers driving the growth of the global advanced packaging market.

Market Introduction:

Advanced packaging describes the grouping and joining of parts before conventional integrated circuit packaging. It makes it possible to combine and package several devices—such as mechanical, semiconductor, or electrical components—as a single electronic device. Advanced packaging uses procedures and methods carried out at semiconductor production facilities compared to standard integrated circuit packaging. It encompasses a range of technologies, including fan-out wafer-level packaging, 2.5D and 3D integrated circuits, system-in-package, and more, and it falls between fabrication and traditional packaging. Advanced packaging can integrate several chips into a package, increasing performance. Through silicon vias, interposers, bridges, or basic wires can connect these devices thicker, boosting signal speed and decreasing energy consumption. Advanced packaging also allows the combining of components created at several manufacturing nodes. Integrated circuits and memory chips can perform better when packaged using advanced techniques like heterogeneous integration and 3D integration. These methods provide higher connection density, feature density, and memory customisation for particular uses. Memory-integrated device manufacturers (IDMs) can optimise memory chips' performance and tailor memory to individual customers using 3D stacking technology.

Advanced Packaging Market Size

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Recent Development

In October 2023, The Integrated Design Ecosystem (IDE), a collaborative design tool set designed to enhance advanced package architecture throughout its VIPack platform systematically, was launched by Advanced Semiconductor Engineering Inc. (ASE). With the help of this creative method, a smooth transition from single-die SoC to multi-die disaggregated IP blocks—including memory and chipsets—for integration with 2.5D or sophisticated fan-out structures is possible.

In June 2023, Amkor Technology Inc., a prominent supplier of semiconductor packaging, test services, and the automotive OSAT, is pioneering advanced packaging to facilitate the future automobile. Sales of semiconductors related to automobiles have increased recently, indicating a significant shift in the enhanced automotive experience. Amkor is well-positioned to benefit from accelerating automotive semiconductor content as a frequent automotive OSAT with more than 40 years of automotive experience and a wide geographic footprint that supports global and enabling regional supply chains.

Market Dynamics:


Increase in demand for miniaturization of devices- Manufacturers across several industry verticals, including consumer electronics, healthcare, automotive, and semiconductor IC production, are focusing more on producing small electronic devices due to the rapid evolution of technology. These manufacturers are shrinking the integrated circuits to guarantee precise patterning on the wafers and chips. The medical device business also sees a rise in demand for sophisticated, wearable, and customised healthcare technologies such as nanoscale robotic surgery equipment. As a result, designers now need to use innovative packaging instead of just traditional methods due to the trend towards smaller electronic gadgets.


High cost- Compared to the standard packaging methods in the semiconductor industry, advanced packaging is a very expensive process. At some point, the cost of developing and producing chips at each successive node is high. Furthermore, because of the intricacy of the ICs, wafer manufacturing is far more expensive. Advanced packaging becomes more expensive overall and is less likely to be adopted when various chips and integrated circuits are packaged with intricate patterns.


Enhanced system efficiency and optimisation- The semiconductor packaging industry offers sophisticated IC packages to create next-generation chip designs. The integrated circuit industry has historically used creative architectures for novel devices and conventional chip scaling. Furthermore, every phone, data centre, consumer electronics device, and network has multi-chip packages, fueling sophisticated packaging development by encouraging system optimisation. Because advanced packaging enables a wide range of distinct processing devices and memories to be coupled via extremely fast interconnects, it encourages using AI, machine learning, and deep learning. As a result, several industry verticals, including the automotive, healthcare, aerospace & defence, and industrial sectors, which are increasingly implementing sophisticated packaging, can profit greatly from improved operation capabilities and precise processing.

Regional segmentation analysis:

The regions analyzed for the market include North America, Europe, South America, Asia Pacific, the Middle East, and Africa. Asia Pacific emerged as the largest global advanced packaging market, with a 43% market revenue share in 2023.

The reason for this is the existence of significant market players in this area, the quick rise in demand for semiconductors across a wide range of industry verticals, including consumer electronics, automotive, aerospace, defence, and many more, as well as the government's significant investments in the construction of semiconductor manufacturing facilities, particularly in developing nations like South Korea, China, and India. These elements collectively propel the expansion of the advanced packaging market. For example, Taiwan Semiconductor Manufacturing Co. (TSMC) stated on September 29, 2021, that it is building new, state-of-the-art packaging facilities in northern Taiwan. System on integrated circuits (SoIC) technology will be developed at this state-of-the-art packaging facility located in Chunan.

Asia Pacific Region Advanced Packaging Market Share in 2023 - 43%

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Type Segment Analysis

The type segment is divided into flip-chip ball grid array, 5D/3D, flip-chip CSP, wafer level CSP, fan out WLP, and others. The Fan-out wafer-level packaging (FOWLP) segment dominated the market, with a market share of around 25% in 2023. Fan-out wafer-level packaging (FOWLP) offers several advantages, including improved performance, substrate-less packaging, and reduced heat resistance. Veeco Instuments Inc., for example, stated on January 11, 2021, that National Chiao Tung University (NCTU), situated in Hsinchu, Taiwan, has been chosen by Veeco to be a significant partner in its endeavour to increase Taiwan's semiconductor output.

End-User Segment Analysis

The end-user segment is divided into automotive, healthcare, consumer electronics, industrial, aerospace & defence, and others. The consumer electronics segment dominated the market, with a market share of around 22% in 2023. There is a rise in market demand for consumer electronics goods like air conditioners, laptops, and cell phones, among many other items. Additionally, the need for electronic equipment miniaturisation will present enormous growth prospects. Each of these variables positively impacts the growth of the advanced packaging market.

Some of the Key Market Players:
  • Taiwan Semiconductor Manufacturing Company Limited
  • Intel Corporation
  • Chipbond Technology Corporation
  • Universal Instruments Corporation
  • Brewer Science Inc.
  • Amkor Technology Inc.
  • Advanced Semiconductor Engineering Inc.
  • JCET Group Co. Ltd
  • Samsung Electronics Co. Ltd
  • ChipMOS Technologies Inc.

Report Description:

Attribute Description
Market Size Revenue (USD Billion)
Market size value in 2023 USD 35.7 Billion
Market size value in 2033 USD 79.9 Billion
CAGR (2024 to 2033) 8.4%
Historical data 2020-2022
Base Year 2023
Forecast 2024-2033
Region The regions analyzed for the market are Asia Pacific, Europe, South America, North America, and Middle East & Africa. Furthermore, the regions are further analyzed at the country level.
Segments Type, End-User

Frequesntly Asked Questions

As per The Brainy Insights, the size of the advanced packaging market was valued at USD 35.7 billion in 2023 to USD 79.9 billion by 2033.

The global advanced packaging market is growing at a CAGR of 8.4% during the forecast period 2024-2033.

Asia Pacific emerged as the largest advanced packaging market.

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This study forecasts global, regional, and country revenue from 2020 to 2033. The Brainy Insights has segmented the global advanced packaging market based on the below-mentioned segments:

Global Advanced Packaging Market By Type:

  • Flip-Chip Ball Grid Array
  • 5D/3D
  • Flip Chip CSP
  • Wafer Level CSP
  • Fan Out WLP
  • Others

Global Advanced Packaging Market By End-User:

  • Automotive
  • Healthcare
  • Consumer Electronics
  • Industrial
  • Aerospace & Defense
  • Others  

Global Advanced Packaging Market By Region:

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • France
    • U.K.
    • Italy
    • Spain
  • Asia-Pacific
    • Japan
    • China
    • India
  • South America
    • Brazil
  • Middle East and Africa  
    • UAE
    • South Africa


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